Thermal Paste

Case ID:

This technology is a novel high-heat transfer material composition, which is a cost-effective thermal paste for use in heat removal applications.

Thermal paste is a material used as an interface between a heat-producing electronic component or device (such as a microprocessor) and a heat dissipation device (heatsink). Thermal paste helps fill in microscopic gaps of air that would exist between the two components if they were joined together just by direct contact. To get the best cooling properties, the thermal paste should be as thermally conductive as possible.

The need for better thermally conductive materials grows as electronics devices become faster and use more power. High power devices generally give off more waste heat, and that heat needs to be dissipated to ensure the devices remain effective and maintain a long life.


  • High power electronics
  • Thermal interface materials


  • Low cost
  • Simple
  • Enables faster computational speed
  • Improves device reliability
  • May be used without heat sink in some applications
Patent Information:
Contact For More Information:
Jonathan Larson
Senior Licensing Manager, College of Science
The University of Arizona
Lead Inventor(s):
Jacob Bernal