Invention:
This technology introduces a photonic accelerator platform for faster, more efficient computing using advanced optical coatings integrated with existing camera technology. It leverages thin film optical coatings (TFOCs) to perform matrix-vector multiplication (MVM). The system integrates these TFOCs with CMOS technology, a standard in microelectronics, to overcome scalability and compatibility challenges in current photonic computing techniques. It allows calculations to be performed with high precision and speed while being energy-efficient and cost-effective. This approach simplifies integration with current systems through its CMOS-compatible design, making it an attractive option for various applications, from defense and automotive industries to data processing. By reducing energy consumption and boosting performance, this technology offers a scalable solution that could improve how large-scale data and complex operations are handled.
Background:
The main problem this technology addresses is the difficulty in scaling and integrating photonic computing with existing systems, which has kept it from becoming commercially viable despite its potential for high-speed, low-energy data processing. Traditional photonic MVM methods such as Multi-Plane Light Conversion (MPLC), Mach-Zehnder Interferometer (MZI)-MVM, and Wavelength Division Multiplexing (WDM)-MVM often face issues such as sensitivity to misalignment, large physical sizes, and environmental sensitivity, which make them impractical for widespread use. This new platform overcomes these challenges through the use of TFOCs which allow precise control of light through multiple thin layers, providing a more reliable and scalable alternative that integrates with current technology. It addresses the limitations of existing methods, offering a more practical path forward for photonic computing in real-world applications.
Applications:
- Optical communications
- Quantum computing
- Signal processing
- Defense
- Optical metrology
Advantages:
- CMOS integration
- Energy efficiency
- Scalability
- Compact design
