Fabrication Of Polymer Waveguide Interconnect Between Chips With A Gap/Step Using Flexible Polymer Dry Film Resist For Photonic Integrated Circuits (PICs)

Case ID:
UA18-107
Invention:

Title: Fabrication Of Polymer Waveguide Interconnect Between Chips With A Gap And/Or Step

 

Invention: This technology describes a new method to form a stable physical barrier between chips within a photonic integrated circuit (PIC), utilizing polymer dry film negative resist. The technique enables the  fabrication of polymer waveguide interconnects.

 

Background: The current standard of applying polymer dry film resists works well for a single chip However, when there is a gap or step between two chips, the resist can break at the gap/step upon removing the backing.

 

Applications:

  • Fabrication of polymer waveguide interconnects
  • Potential for use in creating PICs

 

Advantages:

  • Flexible
  • Provides a physical barrier for waveguides
  • Keep dry film intact

 

 

Patent Information:
Contact For More Information:
Kennedy Nyairo
Sr. Licensing Manager, Optical Sciences
The University of Arizona
knyairo@email.arizona.edu
Lead Inventor(s):
Linan Jiang
Stanley Pau
Robert Norwood
Keywords:
[%Analytics%]