Fabrication of Polymer Waveguide Interconnect Between Chips with a Gap/Step using Flexible Polymer Dry Film Resist for Photonic Integrated Circuits (PICs)

Case ID:

This technology describes a new method to form a stable physical barrier between chips within a photonic integrated circuit (PIC), utilizing polymer dry film negative resist. The technique enables the  fabrication of polymer waveguide interconnects.



The current standard of applying polymer dry film resists works well for a single chip However, when there is a gap or step between two chips, the resist can break at the gap/step upon removing the backing.



  • Fabrication of polymer waveguide interconnects
  • Potential for use in creating PICs



  • Flexible
  • Provides a physical barrier for waveguides
  • Keep dry film intact

Status: issued U.S. patent #11,275,208

Patent Information:
Contact For More Information:
Richard Weite
Senior Licensing Manager, College of Optical Sciences
The University of Arizona
Lead Inventor(s):
Linan Jiang
Stanley Pau
Robert Norwood