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SmartPrint Polymer Material and Design for the Connection of Separate Optical Chips
This technology is a further development of interconnect polymer waveguides for photonics packaging and integration. Here, a flexible optical substrate is attached and aligned to individual photonic chip components to form an optical waveguide. The waveguide comprises a refractive index contrast (RIC) polymer directly patterned using a photolithography...
Published: 12/13/2021   |   Inventor(s): Linan Jiang, Dong-Chul Pyun, Robert Norwood, Tristan Kleine, Julie Frish, Thomas Koch, Stanley Pau, Roland Himmelhuber, Abhinav Nishant, Kyungjo Kim, Sasaan Showghi
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Category(s): Technology Classifications > Engineering & Physical Sciences > Electronics > Assembly and Packaging, Technology Classifications > Engineering & Physical Sciences > Photonics, Technology Classifications > Engineering & Physical Sciences > Semiconductors, Technology Classifications > Imaging & Optics > Fiber Optics, Technology Classifications > Imaging & Optics > Materials & Fabrication > Optical, EO & MO, Technology Classifications > Imaging & Optics > Telecommunications > Electro-Optic Devices, Technology Classifications > Materials > Polymers, Technology Classifications > Software & Information Technology > Communications & Networking, Technology Classifications > Software & Information Technology > Web & Internet, Technology Classifications > Engineering & Physical Sciences > Communications & Networking > Optical, Technology Classifications > Engineering & Physical Sciences > Electronics > Computer Hardware, Technology Classifications > Engineering & Physical Sciences > Electronics > Digital Circuits
Refractive Index Contrast Polymer Photonics Interconnects and Waveguides for Packaging and Integration
This invention represents a new chemical composition of photoresponsive, polymer photoresists, where the refractive index of the polymer can be modulated via UV radiation to facilitate the arbitrary writing of optical waveguides and other photonic devices in the material. The material can be spun on to any substrate or existing photonic device architecture...
Published: 11/10/2020   |   Inventor(s): Dong-Chul Pyun, Robert Norwood, Julie Frish, Tristan Kleine
Keywords(s):  
Category(s): Technology Classifications > Engineering & Physical Sciences > Communications & Networking > Networking, Technology Classifications > Engineering & Physical Sciences > Communications & Networking > Optical, Technology Classifications > Engineering & Physical Sciences > Electronics > Assembly and Packaging, Technology Classifications > Engineering & Physical Sciences > Photonics, Technology Classifications > Imaging & Optics > Telecommunications, Technology Classifications > Imaging & Optics > Telecommunications > Electro-Optic Devices, Technology Classifications > Imaging & Optics > Materials & Fabrication > Optical, EO & MO, Technology Classifications > Materials > Polymers
Copolymerization of Elemental Sulfur and Functional Styrenics
This invention relates to polymeric compositions. In particular, the attractive chemical accessibility and functional diversity of styrenic comonomers used with elemental sulfur to prepare a new chemical platform for sulfur-based polymeric materials and to further enable post-polymerization modifications for improving the properties of sulfur-based...
Published: 7/31/2019   |   Inventor(s): Dong-Chul Pyun
Keywords(s):  
Category(s): Technology Classifications > Energy, Cleantech & Environmental > Energy Collection, Storage & Battery, Technology Classifications > Energy, Cleantech & Environmental > Fuel Cells, Technology Classifications > Energy, Cleantech & Environmental > Petrochemical, Technology Classifications > Engineering & Physical Sciences > Electronics > Assembly and Packaging, Technology Classifications > Materials > Polymers
High Power, Configurable, Pico-Second LED Driver
This technology is a light-emitting diode (LED) driver capable of driving 190mApp of current through an LED. The driver can drive various kinds of LEDs and multiple LEDs in series with up to a total forward voltage of about 8V. The LED is modulated at a single frequency of 200kHz, but future designs could modulate at 1MHz by substituting slower components...
Published: 7/23/2019   |   Inventor(s): Jerrie Fairbanks, Linda Powers, Janet Roveda
Keywords(s):  
Category(s): Technology Classifications > Engineering & Physical Sciences > Electronics > Assembly and Packaging, Technology Classifications > Engineering & Physical Sciences > Electronics > Analog Circuits, Technology Classifications > Engineering & Physical Sciences > Electronics > Digital Circuits, Technology Classifications > Engineering & Physical Sciences > Photonics, Technology Classifications > Engineering & Physical Sciences > Semiconductors, Technology Classifications > Imaging & Optics > Sensors and Detection > Remote Sensing, Technology Classifications > Imaging & Optics > Lasers & Other Sources
Technology for Building Capacitors Using Templates with Nano Scale Pores
The unique feature of this invention is the manufacturing process, which uses commercially available or customized dielectric membrane templates with nano-pores to increase the surface area of the conducting materials allowing for more capacitance per unit area than a parallel plate capacitor could ever hope to achieve. This process will most likely...
Published: 1/12/2016   |   Inventor(s): Olgierd Palusinski, Grzegorz Zareba, Jaeheon Lee, Kenneth Bartley, Zuzanna Siwy
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Category(s): Technology Classifications > Engineering & Physical Sciences, Technology Classifications > Engineering & Physical Sciences > Electronics, Technology Classifications > Engineering & Physical Sciences > Electronics > Assembly and Packaging, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Engineering & Physical Sciences > Semiconductors
Color-Free, Thermally Reworkable Diels-Alder Epoxies with Liquid Precursors
Researchers at the University of Arizona have developed an epoxy which reverts to a liquid upon application of heat. This epoxy is colorless and contains liquid precursors, which can be mixed at room temperature, making it an ideal adhesive for art conservation. This invention solves the issue of irreversibility in epoxy adhesives. Background: Epoxies...
Published: 10/30/2015   |   Inventor(s): Peter Mcfadden, Douglas Loy, Robb Bagge
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Category(s): Technology Classifications > Engineering & Physical Sciences > Electronics > Assembly and Packaging, Technology Classifications > Engineering & Physical Sciences > Industrial & Manufacturing > Construction, Technology Classifications > Materials > Coatings, Technology Classifications > Materials > Polymers
Simplified Process for Fabricating Interdigitated Energy Storage Devices
Researchers at The University of Arizona and the University of California, Irvine, have developed a simplified process to prepare interdigitated energy storage devices (IESD). These are compact, 3-dimensional structures with superior energy densities: projected values are approximately 10,000 times larger than a conventional parallel plate capacitor....
Published: 10/9/2014   |   Inventor(s): Olgierd Palusinski, Grzegorz Zareba, Jaeheon Lee, Kenneth Bartley, Zuzanna Siwy
Keywords(s):  
Category(s): Technology Classifications > Engineering & Physical Sciences, Technology Classifications > Engineering & Physical Sciences > Electronics, Technology Classifications > Engineering & Physical Sciences > Electronics > Assembly and Packaging, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology
Metallic Coating and Circuit Masking using Nanoparticles
This invention covers metals, silica, or glass in a thin metal layer by disclosing the formation of a thin layer of metal from metal (i.e. copper, gold, silver, etc) nanoparticles by only the electrostatic interaction between the nanoparticles and a suitably prepared substrate surface. Background: Electrostatic plating of metal nanoparticles allows...
Published: 9/10/2014   |   Inventor(s): Anthony Muscat, Lance Hubbard
Keywords(s):  
Category(s): Technology Classifications > Engineering & Physical Sciences, Technology Classifications > Engineering & Physical Sciences > Electronics, Technology Classifications > Engineering & Physical Sciences > Electronics > Assembly and Packaging, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Engineering & Physical Sciences > Semiconductors