Search Results - thomas+koch

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SmartPrint Polymer Material and Design for the Connection of Separate Optical Chips
This technology is a further development of interconnect polymer waveguides for photonics packaging and integration. Here, a flexible optical substrate is attached and aligned to individual photonic chip components to form an optical waveguide. The waveguide comprises a refractive index contrast (RIC) polymer directly patterned using a photolithography...
Published: 12/13/2021   |   Inventor(s): Linan Jiang, Dong-Chul Pyun, Robert Norwood, Tristan Kleine, Julie Frish, Thomas Koch, Stanley Pau, Roland Himmelhuber, Abhinav Nishant, Kyungjo Kim, Sasaan Showghi
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Category(s): Technology Classifications > Engineering & Physical Sciences > Electronics > Assembly and Packaging, Technology Classifications > Engineering & Physical Sciences > Photonics, Technology Classifications > Engineering & Physical Sciences > Semiconductors, Technology Classifications > Imaging & Optics > Fiber Optics, Technology Classifications > Imaging & Optics > Materials & Fabrication > Optical, EO & MO, Technology Classifications > Imaging & Optics > Telecommunications > Electro-Optic Devices, Technology Classifications > Materials > Polymers, Technology Classifications > Software & Information Technology > Communications & Networking, Technology Classifications > Software & Information Technology > Web & Internet, Technology Classifications > Engineering & Physical Sciences > Communications & Networking > Optical, Technology Classifications > Engineering & Physical Sciences > Electronics > Computer Hardware, Technology Classifications > Engineering & Physical Sciences > Electronics > Digital Circuits
High-throughput manufacturing for PIC polymer waveguide using multiple exposures
Researchers at the University of Arizona have developed a method of fabricating polymer waveguides in polymer films to form the interconnections between optical devices such as PICs to other PICs and Optical Printed Circuit Boards (OPCBs). Background: An important problem in optical packaging involves the optical interconnection (chip-chip connections)...
Published: 11/29/2018   |   Inventor(s): Linan Jiang, Stanley Pau, Robert Norwood, Thomas Koch
Keywords(s):  
Category(s): Technology Classifications > Imaging & Optics, Technology Classifications > Imaging & Optics > Materials & Fabrication > Optical, EO & MO, Technology Classifications > Imaging & Optics > Telecommunications > Electro-Optic Devices
Optical Printed Circuit Board with Polymer Array Switch
Researchers at the University of Arizona have developed a flexible polymer waveguide array structure that serves as a stitch or jumper on an optical printed circuit board (OPCB). The flexible polymer waveguide array structure can be attached to the OPCB so that it can provide a chip-to-OPCB optical connection. Using an array of small polymer waveguides...
Published: 8/15/2018   |   Inventor(s): Thomas Koch, Robert Norwood, Stanley Pau, Nasser Peyghambarian
Keywords(s):  
Category(s): Technology Classifications > Imaging & Optics, Technology Classifications > Imaging & Optics > Materials & Fabrication > Optical, EO & MO, Technology Classifications > Imaging & Optics > Telecommunications, Technology Classifications > Imaging & Optics > Telecommunications > Electro-Optic Devices
Relaxed Tolerance Adiabatic Coupler for Optical Interconnects
Researchers at the University of Arizona have designed an architecture for photonic integrated circuits (PICs) using a waveguide design that reduces the size of the interconnections and overcomes the mode size mismatch. The design also relaxes alignment tolerances and lower polarization dependence to allow for very fast manufacturing of the PIC interconnections. Background:...
Published: 2/4/2017   |   Inventor(s): Erfan Fard, Robert Norwood, Thomas Koch, Stanley Pau
Keywords(s):  
Category(s): Technology Classifications > Imaging & Optics, Technology Classifications > Imaging & Optics > Materials & Fabrication > Optical, EO & MO, Technology Classifications > Imaging & Optics > Telecommunications, Technology Classifications > Imaging & Optics > Telecommunications > Electro-Optic Devices
High-Throughput Manufacturing for PIC Polymer Waveguide Connection Fabrics
This invention is a low-cost high-throughput method of connecting silicon photonic chips to one another. The method is active and robust, taking into account the tolerances and variations of the PIC configurations. It is also rapid, accurate, immune to large dimensional variation, and amenable to rework. Background: Photonic integrated circuits (PICs)...
Published: 6/14/2016   |   Inventor(s): Thomas Koch, Robert Norwood, Stanley Pau, Nasser Peyghambarian
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Category(s): Technology Classifications > Imaging & Optics > Telecommunications