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A Deep Convolutional Neural Network Model for Rapid and Accurate Thermal Analysis of Computer Chips
This invention is a software-based solution that uses a deep convolutional neural network to predict how heat spreads across a computer chip. It enables engineers and designers to evaluate the thermal behavior of their chip designs quickly and accurately, without relying on time-consuming traditional simulation tools. By transforming a complex engineering...
Published: 10/7/2025
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Updated: 7/28/2025
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Inventor(s): Xiaoyi Wu, Qiuchen Zhang
Keywords(s):
Category(s): Technology Classifications > Engineering & Physical Sciences > Electronics > Testing & Measurement, Technology Classifications > Software & Information Technology > Communications & Networking
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